UniPro Working Group

MIPI Alliance Launches M-PHY v1.0 + UniPro v1.40

 Click here for more information - www.mipi.org/mphyunipro

The MIPI Alliance Standard for UniProSM(Unified Protocol) defines an application-agnostic scalable layered protocol for interconnecting devices and components within mobile systems such as cellular telephones, handheld computers, digital cameras, etc. UniPro allows these devices and components to exchange data at high data rates, with low pin count and at low energy per transferred bit.
 

The networking capabilities of UniPro enable the emergence of sub-systems such as (but not limited to): memory sub-systems, connectivity sub-systems or imaging sub-systems thus driving a faster time-to-market for the integration of innovative solutions and new technologies. Furthermore the networking capabilities of UniPro enable efficient sharing of resources in a multi-master environment while keeping low power consumption.

  

JEDEC UFS, Next generation camera, display and trace system: CSI-3 DSI-2 and Gigabit Trace have already committed to use UniPro.

UniPro is a layered protocol architecture that follows the OSI reference architecture. UniPro defines two PHY Adapter layers (L1.5) to support either D-PHY or M-PHY. Several applications can share a single UniPro stack and benefit from common features such as: 

  • D-PHY and M-PHY
  • Network-ready architecture
  • High Scalable Bandwidth with low pin-count
  • Low power consumption
  • Reliable packet based, latency-aware Traffic Classes

The WG is also updating the framework of the UniPro Testing Program. The framework of the UniPro Testing Program includes:
• Conformance test-suite
• Test assertions

UniPro v1.4  workshops between member companies are currently ongoing.  See the MIPI Testing Page(hyperlink)for more information on MIPI test events and test documents.
 

UniPro specifications are comprised of both in a text document and in a formal normative reference model (SDL). 

Working Group Chair

Miika Rummukainen, Nokia

 

Working Group Vice-Chairs

Hicham Bouzekri, ST-Ericsson
Yoram Rimoni, Qualcomm

 

Member companies represented:

Agilent, Aptina, Arasan, Broadcom, Cadence, Infineon, Intel, Marvell, MCCI, Micron, Nokia, RIM, Renesas, Qualcomm, SanDisk, ST-Ericsson Samsung, SMSC, Synopsys, TI, Toshiba
 

Supporting organizations:

St. Petersburg State University of Aerospace Instrumentation: Model Testing
Testronic Labs: Conformance Testing
IEEE-ISTO: Program Management