Tuesday, May 12, 2020 to Thursday, May 14, 2020


Before cars can be connected, engineers must first connect.

Senior engineers and technologists join AutoSens in May 2020 for its annual USA update in Detroit, Michigan – 500+ international participants put their heads together to lead technical discussions with the purpose of transforming the future of vehicle perception technology. AutoSens connects the world’s leading minds in ADAS and autonomous vehicles to network, collaborate, solve shared challenges and advance autonomous vehicle technologies more rapidly.

Bringing together of the most forward-thinking minds in the industry; it is week of discussions, collaborations, debates, business meetings, interactive learning, autonomous driving demonstrations and technology showcase.

The event connects engineers from several engineering disciplines including automotive imaging, LiDAR, radar, image processing, computer vision, in-car networking, testing and validation, certification and standards. AutoSens is a collaborative environment geared towards supporting engineering activities.

"A perfect mix of cutting edge technology from the autonomous driving community."

"AutoSens is the place to gather experienced ADAS and AD engineers and professionals. It brings a lot to the industry in order to see real problems in development. The topics are really practical and each made a genuine contribution."

"THE event for checking state-of-the-art vehicle sensors and advances, with plenty of technical knowledge widespread around the venue."

"As we have seen and heard; the automotive industry is in a revolution and AutoSens is at the centre."

Attend the MIPI presentation, 13 May, 2:35 PM - 2:55 PM  »

Session Title: A Collaborative Approach to Advancing In-Vehicle Connectivity

This presentation will take a brief look at how MIPI specifications are already being implemented in automotive, followed by an overview of the forthcoming A-PHY specification. Included in the discussion will be industry needs and requirements, A-PHY’s fit with other wired connectivity technologies, and a roadmap to how this specification can be leveraged in the near term as well as in the future.

Speaker: Rick Wietfeldt, Senior Director, Technology, Qualcomm (speaking on behalf of MIPI Alliance)

Rick Wietfeldt, Ph.D., is a senior director, technology, at Qualcomm Technologies Inc. in San Diego. He joined Qualcomm in 2007 and established the Advanced Connectivity Technology office responsible for working with the standards development organizations that drive mobile interface standards.

He has authored numerous publications and been awarded numerous patents in mobile device architecture and operation. Rick also serves on the MIPI Alliance Board of Directors.

Learn more about the event  »

Inquire about the special 15% MIPI discount »

Event Location: 
Michigan Science Center, Detroit MI, USA