See MIPI Alliance at the Linley Spring Processor Conference 2018.
Even as Moore's Law winds down, the processor industry continues to thrive. In the data center, next-generation server processors are now supplemented with a variety of accelerators to offload networking, storage, and deep-learning tasks. Deep learning is also a key technology in the development of ADAS and autonomous-driving systems. Networking equipment is evolving to SDN, NFV, 5G, and other new technologies. And the Internet of Things is quietly gaining traction in both industrial and consumer products. New processor chips and IP cores, along with memory and networking chips, are emerging to support these new applications.
To get the latest information on these new products and trends, mark your calendar for the Linley Spring Processor Conference coming to the Hyatt Regency Hotel, Santa Clara on April 11 - 12.
This two-day event is the only one of its kind focused on the processors and IP cores used in deep learning, embedded, communications, automotive, IoT, and server designs. The Linley Group will open the conference with an overview of the market, technologies, equipment-design, and silicon trends. The second day will start with a keynote from an industry leader to be announced. The remainder of the program will include talks and panel discussions covering a broad range of topics including the following:
The conference includes:
- Sponsor exhibits and demos
- Evening networking reception on the first day
- Raffles by The Linley Group
- Hosted speaker tables at lunch (meet the presenters)
- Free parking
- Continental breakfasts and gourmet lunches
- Free Wi-Fi
Event Location: Hyatt Regency Hotel, Santa Clara, CA
See these MIPI Alliance member demos at the Reception and Exhibits, 11 April, 4:30-6:10pm:
This demo features Synopsys’ complete, proven MIPI Camera and Sensor Interface IP solutions consisting of DesignWare® MIPI CSI-2 Controller, DesignWare MIPI I3C Controller, DesignWare MIPI D-PHY, all of which are immediately available for your mobile, automotive and IoT SoC designs. The demo uses the DesignWare MIPI CSI-2 IP Prototyping Kit to accelerate software development and IP integration.
GOWIN Semiconductor Corp.
This demo showcases GW I3C design, capable of transferring high-speed-data, for example HD Photo to display. I3C wires to link a pair of GOWIN FPGA (GW IP of MIPI Complaint I3C Master/Slave) boards, one board connecting with a HD Camera, another with a LCD display Panel.