Wednesday, March 11, 2020

11 March 2020, 08:30-09:30 PDT

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Because of their key characteristics and proven performance, MIPI specifications have been deployed in countless devices across a broad range of markets, in everything from mobile handsets, to IoT and AR/VR, to automotive. In automotive, these specifications include MIPI CSI-2℠ for cameras, DSI-2℠ for displays and I3C® for sensors, as well as others.

This webinar will provide an in-depth look at the forthcoming MIPI A-PHY℠, a high-speed, “long-reach“ (up to 15m) physical layer specification that will allow native connections to the widely implemented CSI-2 and DSI-2 protocols. The goal is to provide the automotive industry with a standardized approach that offers both high performance and simplified integration, along with the flexibility needed to suit a broad range of speed and design needs.

After an overview of the factors driving A-PHY development, the presentation will cover its structure, topologies and key features, as well as its fit with other wired connectivity technologies. Also included will be discussion of how the specification can be leveraged in the near term as well as in the future.


Matt Ronning, MIPI Automotive Working Group Chair
Raj Kumar Nagpal, MIPI A-PHY Subgroup Lead

Matt Ronning is director of engineering at Sony Corporation and serves as chair for the MIPI Automotive Working Group. Matt is making significant steps leading the group that provides input and coordination on requirements to ensure MIPI is addressing the needs of the automotive industry.

Raj Kumar Nagpal is senior manager at Synopsys and serves as vice chair of the MIPI PHY Working Group, and lead of the A-PHY and D-PHY subgroups. Raj has more than 25 years of research and development experience in various fields of electronics, including RF engineering, high-speed serial links, signal integrity, power integrity and product validation. His work at Synopsys focuses on high-speed serial links architecture/system-level modeling, as well as signal integrity and power integrity domains of high-speed serial links. Raj has a master's of engineering degree in microwave electronics from the University of Delhi and earned his bachelor of technology degree in electronics and communication from Nagpur University.


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