Tuesday, November 16, 2021

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16 November 2021
09:00 a.m. PST

Overview

MIPI Alliance standards have been driving the adoption of newer features and higher data rates for emerging mobile applications.

The multi-gigabit data rates have brought along challenges in testing the physical and protocol layers. MIPI Alliance working groups have defined eye-opening analysis for short, standard and long channels to ensure reliable operation of MIPI C-PHY℠ and MIPI D-PHY℠ data rates. Oscilloscope-based protocol layer validation enables the isolation of protocol problems caused either by the PHY or protocol layer. This webinar provides insight into the following new requirements of PHY and protocol layer test needs of MIPI Alliance specifications. 

In this webinar, Ravi Malladi and Godfree Coelho will cover the following aspects of MIPI testing:

  • Diamond and hexagonal eye masks in C-PHY 2.0
  • Embed/de-embed for different channels in D-PHY 2.1
  • CTLE requirements of C-PHY 2.0
  • Probing in C-PHY 2.0 and D-PHY 2.1
  • Overview of M-PHY® v4.1 and plans ahead
  • Optimum HW/SW configuration for C-PHY 2.0 and D-PHY 2.1
  • Protocol covering aspects of RFFE℠, UFS, I3C and SPMI℠

Who should attend

Design engineers, test engineers, post silicon validation engineers, system design engineers, engineering managers, application engineers, SoC emulation engineers, RTL engineers, firmware engineers and hardware engineers, etc.

Presenters

Ravi Malladi
Ravi Malladi is a product marketing manager with Tektronix, looking after MIPI, memory and Ethernet applications portfolio. Prior to this, he was a field application engineer for high-speed serial communications. Ravi has 20 years of R&D, techno-commercial and product line management experience and holds a master of science segree in physics from Delhi University and a master of technology degree in instrumentation from the National Institute of Technology Kurukshetra.

Prodigy Technovations webinar presenter Godfree Coelho

Godfree Coelho
Godfree Coelho is founder and CEO of Prodigy Technovations and has 25 years of experience in the test and measurement domain. He previously worked for Tektronix and HP/Agilent. He is involved in developing different protocol analysis solutions for high and low speed serial bus applications such as UFS4.0, eMMC, SPMI, RFFE and others.