The Embedded World Exhibition & Conference was held 14-16 March in Nuremberg, Germany, to bring together researchers and developers, industry and academia from all disciplines of embedded system development. MIPI Alliance specifications were the focus of two “Board Level Hardware Engineering” tracks focused on MIPI I3C® and MIPI in automotive, as well as additional sessions covering MIPI CSI-2® and display specifications.
All About MIPI I3C: The Next-Generation Utility and Control Bus
Presented by Michele Scarlatella, IoT technical consultant, MIPI Alliance
Advantages of MIPI I3C Enabling Simpler Design in a Variety of End Equipment Applications
Presented by Saminah Chaudhry, Texas Instruments
An Efficient Prototyping Framework for I3C Controllers
Presented by Aradhana Kumari, STMicroelectronics
MIPI A-PHY: Pushing the Boundaries of Automotive Connectivity
Presented by Edo Cohen, co-chair of the MIPI A-PHY Working Group
MIPI Automotive SerDes Solutions: Using a Standards-Based Approach for Functional Safety and Security Protection of Automotive Sensor Systems
Presented by Ariel Lasry, vice chair of the MIPI A-PHY Working Group
How To Overcome Cable Length Limitations in MIPI CSI-2 Based Systems
Presented by Sebastian Guenther, Allied Vision
Using a Standards-Based Framework to Meet the Growing Bandwidth and Safety Requirements of Next-Generation Automotive Displays (Electronic Displays Conference)
Presented by Ariel Lasry, vice chair of the MIPI A-PHY Working Group
Applications of MIPI UPLS Mode in Client Computing to Save System Power
Presented by Satheesh Chellappan, Lattice Semiconductor
Using Smarter Interfaces for Edge Computing in Machine-Vision Applications
Presented by Haran Thanigasalam, camera and imaging technical consultant, MIPI Alliance