--- title: MIPI Specifications for Embedded and Automotive Applications To Be Featured at embedded world Conference description: The April 9-11 event in Nuremberg, Germany, will feature 12 MIPI-related presentations, including tracks for I3C, camera & display, and automotive design. --- [Press Releases ](https://www.mipi.org/press-releases) # [MIPI Specifications for Embedded and Automotive Applications To Be Featured at embedded world Conference](https://www.mipi.org/press-releases/mipi-specifications-for-embedded-and-automotive-applications-to-be-featured-at-embedded-world-conference) Written by [MIPI Alliance](https://www.mipi.org/press-releases/author/mipi-alliance) | 29 February, 2024 #### *April 9-11 event in Nuremberg, Germany, to include 12 MIPI-related presentations *   **PISCATAWAY, N.J., **February 29, 2024—The [MIPI Alliance](https://www.mipi.org/), an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced that the 22nd embedded world Exhibition & Conference, scheduled for April 9-11 in Nuremberg, Germany, will include a dozen presentations showcasing MIPI specifications, including three dedicated education tracks focused on MIPI camera and display specifications, MIPI in automotive, and the MIPI I3C utility and control bus. The event covers all aspects of the development and application of embedded systems, from fundamental technologies to development processes and special fields of applications. MIPI Alliance is again serving as a Community Partner for the event, and members can [register for the conference](https://events.weka-fachmedien.de/embedded-world-conference/registration/#/) using the code “EWC24MIPI” to receive a 10% discount. **WHAT: **[Embedded World Exhibition & Conference](https://events.weka-fachmedien.de/embedded-world-conference/home/) **WHEN: **April 9-11, 2024 **WHERE: **Nuremberg, Germany **WHO SHOULD ATTEND:** Engineers and technical management working along the intersection of applied research and industrial applications of embedded systems.   ### MIPI CONFERENCE TRACKS: The embedded world program includes nine MIPI-powered presentations within three Board Level Hardware Engineering tracks that will highlight [MIPI I3C](https://www.mipi.org/specifications/i3c-sensor-specification), MIPI Camera Serial Interface 2 ([CSI-2](https://www.mipi.org/specifications/csi-2)), MIPI Display Serial Interface ([DSI](https://www.mipi.org/specifications/dsi)) and [MIPI A-PHY](https://www.mipi.org/specifications/a-phy). Three more MIPI member presentations will be featured within other sessions over the three-day event. #### MIPI I3C Track - powered by MIPI Session 5.4 Board Level Hardware Engineering 10 April | 11:00-12:45 - **MIPI I3C, The Next-Generation Utility and Control Bus Supporting Time-Critical Applications**** **Michele Scarlatella (MIPI Alliance) - **Demystifying I3C Protocol** Martin Cavallo (Binho) - **Demonstrating the Benefits of I3C Through Real World Implementations** Lars Häring (Microchip Technology) #### MIPI Track - powered by MIPI Session 5.5 Board Level Hardware Engineering 10 April | 13:45-15:30 - **Challenges and Solution Supporting HiRes 13+ MP Camera Sensors within MIPI D-PHY Domain** Mark Hoopes (Lattice Semiconductor) - **A MIPI DSI/CSI-2/D-PHY Deep Dive** Ali Osman Ors (NXP Semiconductors) - **MIPI CSI-2 - Enabling Machine Vision in Industrial Applications** Ariel Lasry (Qualcomm), Vice Chair of the A-PHY Working Group #### Automotive Design Track Session 5.10 Board Level Hardware Engineering 11 April | 09:30-11:15 - **MIPI A-PHY Camera Ingestion for Automotive x86 Architectures** Frederik John and Dr. Stephanie Friederich (Intel Deutschland) - **Connecting the Automotive Future: A Harsh Environment for Moving Bits** Dr. Julien Henaut (BitifEye Test Solutions) and Eyran Lida (Valens Semiconductor) - **MIPI A-PHY v2.0 Automotive SerDes Interface - Supporting Software-Defined Vehicles and Next-Generation Centralized Automotive E/E Architectures** Edo Cohen (Valens Semiconductor), Co-Chair of the MIPI A-PHY Working Group   ### MORE MIPI MEMBER PRESENTATIONS: - **How Can Connectivity Innovations Transform Machine Vision Applications in the Industrial Market?**** **Yaki Sfadya (Valens Semiconductor) Session 7.3 Standards - Embedded Vision and Edge AI Standards 9 April | 16:00 - 16:30 - **Centralizing Radar Processing with High-Speed Connectivity** Edo Cohen (Valens Semiconductor) Session 2.12 Wireless 2 - Connectivity Solutions 11 April | 15:00 - 15:30 - **Reducing the Microcontroller Pin Count by Utilizing its I3C Interface for Debugging** Ingo Rohloff (Lauterbach) Session 6.12 Debugging - Systems & Software Engineering 11 April | 15:30 - 16:00 Detailed descriptions of these sessions can be found at [MIPI Events](https://www.mipi.org/knowledge-library/conference-presentations/mipi-sessions-2024-embedded-world-conference). See the full agenda: [embedded world Conference Program](https://events.weka-fachmedien.de/embedded-world-conference/program/). To discover more about MIPI Alliance, subscribe to its [blog ](https://www.mipi.org/blog)and connect with its social networks by following MIPI on [Facebook](https://www.facebook.com/mipialliance/), [LinkedIn ](https://www.linkedin.com/company/mipi-alliance/)and [X](http://www.twitter.com/MIPI_Alliance).   ### About MIPI Alliance MIPI Alliance (MIPI) develops interface specifications for mobile and mobile-influenced industries. There is at least one MIPI specification in every smartphone manufactured today. The organization has over 375 member companies worldwide and more than 15 active working groups delivering specifications within the extended mobile ecosystem. Members of the organization include handset manufacturers, device OEMs, software providers, semiconductor companies, application processor developers, IP tool providers, automotive OEMs and Tier 1 suppliers, and test and test equipment companies, as well as camera, tablet and laptop manufacturers. For more information, please visit [www.mipi.org](https://www.mipi.org/). *MIPI**®**, A-PHY**®**,** **CSI-2**®**, DSI**®** and I3C® **are registered trademarks owned by MIPI Alliance*. *D-PHY℠** is a service mark of MIPI Alliance.*   ### Press Contact: Becky Obbema Interprose for MIPI Alliance +1 408.569.3546 [becky.obbema@interprosepr.com](mailto:becky.obbema@interprosepr.com) [View full post](https://www.mipi.org/press-releases/mipi-specifications-for-embedded-and-automotive-applications-to-be-featured-at-embedded-world-conference) ```json { "@context" : "http://schema.org", "@type" : "BlogPosting", "author" : { "@type" : "Person", "name" : "MIPI Alliance" }, "dateModified" : "2024-02-29T11:30:00.576Z", "datePublished" : "2024-02-29T11:30:00Z", "headline" : "MIPI Specifications for Embedded and Automotive Applications To Be Featured at embedded world Conference", "image" : { "@type" : "ImageObject", "height" : 667, "url" : "https://2384176.fs1.hubspotusercontent-na1.net/hubfs/2384176/Embedded-World-2024.jpg", "width" : 1000 }, "mainEntityOfPage" : "https://www.mipi.org/press-releases/mipi-specifications-for-embedded-and-automotive-applications-to-be-featured-at-embedded-world-conference", "publisher" : { "@type" : "Organization", "logo" : { "@type" : "ImageObject", "height" : 60, "url" : "/hs/hsstatic/content_shared_assets/static-1.4092/img/default-amp-logo.png", "width" : 60 }, "name" : "Press Releases" } } ```