24 February 2026 | 9-10:30 a.m. (PST)
MIPI CSI-2®, together with MIPI D-PHY™ and C-PHY™ physical layers, form the foundation of image sensor solutions across a wide range of markets, including smartphones, computing, automotive, robotics and beyond. This webinar will explore the latest CSI-2 feature developments and the continued evolution of MIPI’s low-energy, high-performance physical layer transport solutions–D-PHY and C-PHY–which leverage differential and ternary signaling, respectively.
Attendees will gain insight into recently adopted capabilities such as event-based sensing and processing, as well as D‑PHY embedded clock mode. The session will also cover near-term enhancements, including dual-PHY macro support and multi-drop bus capability, along with a forward-looking view of longer-term feature developments. By the close of the webinar, attendees will understand how MIPI imaging solutions are enabling next-generation computer and machine vision applications across a wide range of product ecosystems.