An interface transporting audio for larger-sized components in mobile and mobile-influenced designs

Quick Facts

Advantages

Widely used in smartphones to interface larger-sized audio components

Physical Layer

CMOS I/Os

Fundamental features
  • High performance
  • Low power
  • Low EMI
Use Cases

Multichannel high-quality audio streams

Phase coherence for stereophonic sound

Microphone arrays

Industries

Icon of a Smart PhoneIcon of a TabletIcon of a laptopIcon of an AutomobileIcon of a cloud with the letters IoT inside.

Overview

MIPI SLIMbus®, introduced by MIPI Alliance in 2007, is used in hundreds of millions of mobile terminals. The specification supports a wide range of digital audio and control solutions to seamlessly transport audio and related data for larger-sized mobile device components such as the application processor, audio codec, modem, audio digital signal processor, Bluetooth chipset and FM receiver.  Multiple components can be interconnected on the same link to lower overall system costs and facilitate flexible designs.

MIPI SLIMbus is developed by the MIPI Low Speed Multipoint Link (LML) Working Group.

The specification’s key features include a single data rate, fixed frame size, clock handover capabilities for low-power operation in certain use cases, unified messages, and device-to-device communications.

The most recent update, MIPI SLIMbus v2.0, released in August 2015, can scale bandwidth via reduced number of ports to simplify integration and minimize board space. It supports multichannel high-quality audio streams, phase coherence to enable stereophonic sound, microphone arrays and other compelling features. It can coexist with MIPI SoundWire or non-MIPI Alliance interfaces through bridging solutions.

Note: The full specification is available only to MIPI Alliance members. For information about joining MIPI Alliance, visit Join MIPI.

 

Versions

Current Version: 
v2.0 (August 2015)

Members Section