Key MIPI Specifications
MIPI Alliance members develop the world’s most comprehensive set of interface specifications for mobile and mobile-influenced products. Here are a few of our major specifications.
CSI-2®
MIPI Camera Serial Interface 2
A widely adopted, high-speed protocol for transmission of still and video images from image sensors to application processors
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DSI-2℠
MIPI Display Serial Interface 2
A forward-looking, scalable high-speed interface that specifies the high-bandwidth link between host processors and displays

I3C®
MIPI Improved Inter Integrated Circuit
A scalable utility and control bus interface for connecting peripherals to an application processor
Learn More

C-PHY℠
Physical Layer
A physical layer for high-performance, cost-optimized cameras and displays

D-PHY℠
Physical Layer
A physical layer for high-performance, cost-optimized cameras and displays

A-PHY®
Physical Layer
Long-reach SerDes physical layer specification advancing ADAS, ADS, IVI and other automotive applications

SoundWire®
Audio Interface
A comprehensive, unified interface for small audio peripherals
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RFFE℠
MIPI RF Front-End Control Interface
A control interface that simplifies integration of complex RF front-end devices
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News & Events
A-PHY® v1.1.1
May 2023
D-PHY℠ v3.5
May 2023
DCS℠ v2.0
May 2023
DSI-2℠ v2.1
May 2023
SPP℠ v2.1
May 2023
RFFE℠ v3.1
Apr 2023
CCS℠ v1.1.1
April 2023
A-PHY PAL℠/I2C v1.0.1
Feb 2023
I3C HCI℠ v1.2
Apr 2023
PAL℠/SPI v1.0
Apr 2023
DisCo℠ for I3C v1.1
Feb 2023
DisCo℠ for NIDnT℠ v1.1
Feb 2023
MIPI Camera Week Webinars
27 & 29 November | 8-9 a.m. (PST)
29 November 2023 | 5 p.m. (PST) / 10 a.m. (JST)