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Interface specifications for mobile, automotive, IoT and more

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Key MIPI Specifications

MIPI Alliance members develop the world’s most comprehensive set of interface specifications for mobile and mobile-influenced products. Here are a few of our major specifications.


MIPI Camera Serial Interface 2

A widely adopted, high-speed protocol for transmission of still and video images from image sensors to application processors

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MIPI Display Serial Interface 2

A forward-looking, scalable high-speed interface that specifies the high-bandwidth link between host processors and displays

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MIPI Improved Inter Integrated Circuit

A scalable utility and control bus interface for connecting peripherals to an application processor

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Physical Layer

A physical layer for high-performance, cost-optimized cameras and displays

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Camera and Display


Physical Layer

A physical layer for high-performance, cost-optimized cameras and displays

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Physical Layer

Long-reach SerDes physical layer specification advancing ADAS, ADS, IVI and other automotive applications

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Audio Interface

A comprehensive, unified interface for small audio peripherals

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MIPI RF Front-End Control Interface

A control interface that simplifies integration of complex RF front-end devices

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News & Events

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Prodigy Webinar November 2023

Member-Hosted Webinar:

UFS 4.0 - Protocol Analysis, Validation and Conformance Testing

8 November 2023 | Two sessions: 8:30-9:30 a.m. (CET) & 8:30-9:30 a.m. (PST)

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San Diego Skyline reduction

MIPI Camera Week Webinars

27 & 29 November | 8-9 a.m. (PST)
29 November 2023 | 5 p.m. (PST) / 10 a.m. (JST)

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MIPI I3C Webinar Series: Exploring the World of I3C

5-8 February 2024
Virtual Event

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Vienna Member Meeting

MIPI Member Meeting Europe #65

4-8 March 2024 Vienna, Austria

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Application Areas

Board Member Companies

Google LLC Intel Corporation Qualcomm Incorporated Robert Bosch GmbH
Samsung Electronics Co. STMicroelectronics Synopsys Inc. Texas Instruments

See all Board and Contributor level members

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