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Moving Mobile Forward

Interface specifications for mobile, automotive, IoT and more

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Key MIPI Specifications

MIPI Alliance members develop the world’s most comprehensive set of interface specifications for mobile and mobile-influenced products. Here are a few of our major specifications.

CSI-2®

MIPI Camera Serial Interface 2

A widely adopted, high-speed protocol for transmission of still and video images from image sensors to application processors

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DSI-2

MIPI Display Serial Interface 2

A forward-looking, scalable high-speed interface that specifies the high-bandwidth link between host processors and displays

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Display

I3C®

MIPI Improved Inter Integrated Circuit

A scalable utility and control bus interface for connecting peripherals to an application processor

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C-PHY

Physical Layer


A physical layer for high-performance, cost-optimized cameras and displays

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Camera and Display

D-PHY

Physical Layer

A physical layer for high-performance, cost-optimized cameras and displays

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A-PHY®

Physical Layer

Long-reach SerDes physical layer specification advancing ADAS, ADS, IVI and other automotive applications

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SoundWire®

Audio Interface

A comprehensive, unified interface for small audio peripherals

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RFFE

MIPI RF Front-End Control Interface

A control interface that simplifies integration of complex RF front-end devices

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News & Events

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DisCo℠ v1.1
November 2024

Debug Over IPS v1.0.1
October 2024

PAL℠/GPIO v1.1
September 2024

Camera Security v1.0
August 2024

Camera Security Profiles v1.0
August 2024

A-PHY® v2.0
July 2024

PAL℠/I2C v1.1
July 2024

DCS℠ v2.1
July 2024

DSI-2℠ v2.2
July 2024

Debug Over I3C℠ v1.1
May 2024

CSE℠ v2.0
April 2024

 

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Invision-Days-Dec2024

MIPI Keynote at inVISION Days 2024

3-5 December 2024
Virtual Event

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Debug-Webinar-Series-LI-Website

MIPI Debug Webinar Series

4-5 December 2024
Virtual Event

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DesignCon2025

See Us at the Drive World Conference at DesignCon 2025

28-30 January 2025
Santa Clara, Calif.

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ew-2025-no-CFP

MIPI Sessions at embedded world 2025

11-13 March 2025
Nuremberg, Germany

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Application Areas

Board Member Companies

Google LLC Intel Corporation Qualcomm Incorporated Robert Bosch GmbH
Samsung Electronics Co. STMicroelectronics Synopsys Inc. Texas Instruments

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