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      Moving Mobile Forward

      Interface specifications for mobile, automotive, IoT and more

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      Key MIPI Specifications

      MIPI Alliance members develop the world’s most comprehensive set of interface specifications for mobile and mobile-influenced products. Here are a few of our major specifications.

      CSI-2®

      MIPI Camera Serial Interface 2

      A widely adopted, high-speed protocol for transmission of still and video images from image sensors to application processors

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      Banner Images - MIPI (1)-3

      DSI-2™

      MIPI Display Serial Interface 2

      A forward-looking, scalable high-speed interface that specifies the high-bandwidth link between host processors and displays

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      Display

      I3C®

      MIPI Improved Inter Integrated Circuit

      A scalable utility and control bus interface for connecting peripherals to an application processor

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      AdobeStock_372513713

      C-PHY™

      Physical Layer


      A physical layer for high-performance, cost-optimized cameras and displays

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      Camera and Display

      D-PHY™

      Physical Layer

      A physical layer for high-performance, cost-optimized cameras and displays

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      AdobeStock_425310788

      A-PHY®

      Physical Layer

      Long-reach SerDes physical layer specification advancing ADAS, ADS, IVI and other automotive applications

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      car-1-1-1

      SWI3S®

      MIPI SoundWire I3S

      A scalable, low-power, and noise-resilient embedded audio interface for all device form factors, large and small

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      Banner Images - MIPI (8)-1-1

      RFFE™

      MIPI RF Front-End Control Interface

      A control interface that simplifies integration of complex RF front-end devices

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      Banner Images - MIPI (15)-1

      See all MIPI Alliance specifications

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      News & Events

      Birds of a Feather (BoF) Groups

       

      Physical AI BoF

      Open to MIPI members and nonmembers interested in helping shape the future of MIPI specifications in humanoids

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      Die-to-Die BoF

      Open to all MIPI members interested in exploring potential new die-to-die or dual-purpose (die-to-die and chip-to-chip) solutions

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      San-Fransico-Website

      MIPI Member Meeting North America #74

      1-5 March 2027
      San Francisco, Calif., USA

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      EW-2027-Nuremberg-CFP-LI-Website-generic

      embedded world 2027

      16-18 March 2027
      Nuremberg, Germany

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      brussels updated

      MIPI Member Meeting Europe #75

      14-18 June 2027
      Brussels, Belgium

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      AdobeStock_310856432_Seoul_1

      MIPI Member Meeting Asia #76

      15-19 November 2027
      Seoul, South Korea

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      Application Areas

      Board Member Companies

      Google LLC Intel Corporation Qualcomm Incorporated Samsung Electronics, Co.
      Sony Semiconductor Solutions Corporation STMicroelectronics Synopsys Inc. Texas Instruments

      See all Board and Contributor level members

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