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Moving Mobile Forward

Interface specifications for mobile, automotive, IoT and more

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Key MIPI Specifications

MIPI Alliance members develop the world’s most comprehensive set of interface specifications for mobile and mobile-influenced products. Here are a few of our major specifications.

CSI-2®

MIPI Camera Serial Interface 2

A widely adopted, high-speed protocol for transmission of still and video images from image sensors to application processors

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DSI-2

MIPI Display Serial Interface 2

A forward-looking, scalable high-speed interface that specifies the high-bandwidth link between host processors and displays

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Display

I3C®

MIPI Improved Inter Integrated Circuit

A scalable utility and control bus interface for connecting peripherals to an application processor

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C-PHY

Physical Layer


A physical layer for high-performance, cost-optimized cameras and displays

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Camera and Display

D-PHY

Physical Layer

A physical layer for high-performance, cost-optimized cameras and displays

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A-PHY®

Physical Layer

Long-reach SerDes physical layer specification advancing ADAS, ADS, IVI and other automotive applications

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SoundWire®

Audio Interface

A comprehensive, unified interface for small audio peripherals

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RFFE

MIPI RF Front-End Control Interface

A control interface that simplifies integration of complex RF front-end devices

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News & Events

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CSI-2® v4.1
April 2024

CSE℠ v2.0
April 2024

DSE℠ v1.1
April 2024

DisCo℠ for SoundWire® v2.1
February 2024

STP℠ v2.4
February 2024

SDCA℠ v1.0
December 2023

Power Over A-PHY℠ v1.0
October 2023

A-PHY® v1.1.1
May 2023

D-PHY℠ v3.5
May 2023

DCS℠ v2.0
May 2023

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Taipei-MM-Website

MIPI Member Meeting Asia #67

9-13 September 2024
Taipei, Taiwan

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Demo-Day-Upcoming-Event

MIPI Demo Day Taipei 2024

11 September 2024
Taipei, Taiwan

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Boston-MM-Website

MIPI Member Meeting North America #68

24-28 March 2025
Boston, Mass., USA

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MIPI Member Meeting #69 - Warsaw, Poland

MIPI Member Meeting Europe #69

23-27 June 2025
Warsaw, Poland

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Application Areas

Board Member Companies

Google LLC Intel Corporation Qualcomm Incorporated Robert Bosch GmbH
Samsung Electronics Co. STMicroelectronics Synopsys Inc. Texas Instruments

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