Key MIPI Specifications
MIPI Alliance members develop the world’s most comprehensive set of interface specifications for mobile and mobile-influenced products. Here are a few of our major specifications.
CSI-2®
MIPI Camera Serial Interface 2
A widely adopted, high-speed protocol for transmission of still and video images from image sensors to application processors
DSI-2℠
MIPI Display Serial Interface 2
A forward-looking, scalable high-speed interface that specifies the high-bandwidth link between host processors and displays
I3C®
MIPI Improved Inter Integrated Circuit
A scalable utility and control bus interface for connecting peripherals to an application processor
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C-PHY℠
Physical Layer
A physical layer for high-performance, cost-optimized cameras and displays
D-PHY℠
Physical Layer
A physical layer for high-performance, cost-optimized cameras and displays
A-PHY®
Physical Layer
Long-reach SerDes physical layer specification advancing ADAS, ADS, IVI and other automotive applications
SoundWire®
Audio Interface
A comprehensive, unified interface for small audio peripherals
RFFE℠
MIPI RF Front-End Control Interface
A control interface that simplifies integration of complex RF front-end devices
News & Events
PAL℠/GPIO v1.1
September 2024
Camera Security v1.0
August 2024
Camera Security Profiles v1.0
August 2024
A-PHY® v2.0
July 2024
PAL℠/I2C v1.1
July 2024
DCS℠ v2.1
July 2024
DSI-2℠ v2.2
July 2024
Debug Over I3C℠ v1.1
May 2024
CSI-2® v4.1
April 2024
CSE℠ v2.0
April 2024
DSE℠ v1.1
April 2024
See Us at the Drive World Conference at DesignCon 2025
28-30 January 2025
Santa Clara, Calif.