MIPI Alliance
22-24 September 2026 | Anaheim, Calif.
The third edition of the embedded world North America Exhibition & Conference was held 22-24 September 2026, in Anaheim, Calif. This premier event for the embedded systems industry connects researchers, developers, industry and academia from all disciplines of the embedded world.
MIPI specifications were the focus of two tracks on 24 September: "MIPI Protocols and Interfaces" and "MIPI Vision, Display and Imaging," with three presentations in each track. Another MIPI presentation was featured in the "Cross-Cutting: Interface, Power and Lifecycle" track, also on 24 September.
MIPI session presentations are available to download below.
MIPI Protocols and Interfaces
Discover how MIPI I3C® simplifies embedded system design with higher performance, lower power, fewer pins, and advanced features such as dynamic addressing and in-band interrupts. Through real-world examples spanning consumer, IoT, and datacenter applications, this session demonstrated how I3C streamlines designs, supports AI-enabled devices, and is ready for deployment today.
Modern wired audio accessories still rely on fragmented interfaces for audio and control. This session introduced MIPI SWI3S®, a standardized interface that unifies both audio and control signaling into a single interface, reducing design complexity and improving interoperability. Through a smart headset case study, learn where SWI3S fits, how it compares to alternatives, and when it makes sense to adopt.
JEDEC UFS 5.0, powered by MIPI M-PHY® v6.0 and MIPI UniPro® v3.0, delivers the bandwidth and efficiency needed for next-generation edge AI. This session explained how faster, more efficient storage accelerates on-device LLMs, automotive systems, robotics, and flagship mobile devices, enabling faster model loading, lower latency, and reduced cloud dependence.
MIPI Vision, Display and Imaging
Upcoming MIPI D-PHY™ and C-PHY™ enhancements simplify embedded camera and display connectivity. This session introduced Multipoint, which enables multiple devices to share a single high-speed link, and Unified Serial Link (USL), which integrates control with data transport. Learn how these capabilities reduce complexity, improve scalability, and streamline embedded system design.
Edge AI vision systems demand high-bandwidth, low-latency, and reliable connectivity that traditional interfaces cannot provide. This session explored how MIPI A-PHY® enables long-reach, high-speed sensor-to-processor links, simplifying system architecture while improving robustness, cost, and scalability. Real-world examples span automotive, industrial, medical imaging, and professional AV applications.
As cameras become critical to automotive, mobile, and industrial systems, securing imaging pipelines without compromising power, performance, or area is essential. This session explored the MIPI Camera Security Framework, which includes MIPI Camera Service Extensions v2.0, explaining how it provides end-to-end camera security while enabling efficient, standards-based implementation across diverse imaging applications.
Cross-Cutting: Interface, Power and Lifecycle
MIPI I3C® is rapidly becoming the preferred serial interface for embedded sensors and control. This session reviewed the latest ecosystem developments, key capabilities beyond I²C, and new features in the upcoming I3C v1.3 specification, including extended bus lengths, multi-bus bridging, functional safety, and data protection, with practical guidance for embedded system designers.