Key MIPI Specifications
MIPI Alliance members develop the world’s most comprehensive set of interface specifications for mobile and mobile-influenced products. Here are a few of our major specifications.
CSI-2®
MIPI Camera Serial Interface 2
A widely adopted, high-speed protocol for transmission of still and video images from image sensors to application processors
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DSI-2℠
MIPI Display Serial Interface 2
A forward-looking, scalable high-speed interface that specifies the high-bandwidth link between host processors and displays

I3C®
MIPI Improved Inter Integrated Circuit
A scalable utility and control bus interface for connecting peripherals to an application processor
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C-PHY℠
Physical Layer
A physical layer for high-performance, cost-optimized cameras and displays

D-PHY℠
Physical Layer
A physical layer for high-performance, cost-optimized cameras and displays

A-PHY®
Physical Layer
Long-reach SerDes physical layer specification advancing ADAS, ADS, IVI and other automotive applications

SoundWire®
Audio Interface
A comprehensive, unified interface for small audio peripherals
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RFFE℠
MIPI RF Front-End Control Interface
A control interface that simplifies integration of complex RF front-end devices
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News & Events
DisCo for I3C v1.1
Feb 2023
DisCo for NIDnT v1.1
Feb 2023
A-PHY PAL/I2C v1.0.1
Feb 2023
DisCo for Imaging v1.0
Dec 2022
PAL/CSI-2 v1.1
Nov 2022
CSI-2® v4.0.1
Nov 2022
I3C TCRI v1.0
Sep 2022
SyS-T v1.1
Sep 2022
PTI v2.0.1
Jul 2022
SoundWire v1.2.1
Jun 2022
UniPro v2.0
Jun 2022