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Moving Mobile Forward

Interface specifications for mobile, automotive, IoT and more

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Key MIPI Specifications

MIPI Alliance members develop the world’s most comprehensive set of interface specifications for mobile and mobile-influenced products. Here are a few of our major specifications.

CSI-2®

MIPI Camera Serial Interface 2

A widely adopted, high-speed protocol for transmission of still and video images from image sensors to application processors

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DSI-2

MIPI Display Serial Interface 2

A forward-looking, scalable high-speed interface that specifies the high-bandwidth link between host processors and displays

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Display

I3C®

MIPI Improved Inter Integrated Circuit

A scalable utility and control bus interface for connecting peripherals to an application processor

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C-PHY

Physical Layer


A physical layer for high-performance, cost-optimized cameras and displays

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Camera and Display

D-PHY

Physical Layer

A physical layer for high-performance, cost-optimized cameras and displays

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A-PHY®

Physical Layer

Long-reach SerDes physical layer specification advancing ADAS, ADS, IVI and other automotive applications

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SoundWire®

Audio Interface

A comprehensive, unified interface for small audio peripherals

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RFFE

MIPI RF Front-End Control Interface

A control interface that simplifies integration of complex RF front-end devices

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News & Events

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PTI v2.0.1
Jul 2022

SoundWire v1.2.1
Jun 2022

Debug for I3C v1.0.1
Jun 2022

UniPro v2.0
Jun 2022

NIDnT v1.2.1
Jun 2022

STP v2.3
Jun 2022

 

MIPI PAL/ETH
Mar 2022

A-PHY v1.1
Dec 2021

CSI-2® v4.0
Dec 2021

M-PHY® v5.0
Sep 2021

CSE v1.0
Sep 2021

DSI® v1.3.2
Sep 2021

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MIPI Member Webinar: Introduction to the Fundamentals of I3C (presented by Introspect Technology)

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MIPI Member Webinar: Next-Gen Sensor Connectivity with MIPI A-PHY (presented by Valens & OMNIVISION)

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See Us at AutoSens Brussels 2022

13-14 September 2022

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MIPI DevCon (virtual)

Application Areas

Board Member Companies

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ST-logo-04-2021 Synopsys Inc. Texas-Instruments-logo

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