An application-agnostic transport layer for chip-to-chip/IPC applications in traditional or modular device architectures

Quick Facts

Adopted by

JEDEC UFS, Linaro Greybus, MIPI CSI-3

Used in

Traditional phone architectures, modular phone platforms, UFS N and flash interfaces

Physical Layer


Fundamental features
  • High performance
  • Low power
  • Low EMI
Use Cases

Networking components

Modular designs


Flash storage

Video streaming

Automotive infotainment systems


Icon of a Smart PhoneIcon of a TabletIcon of a laptopIcon of an AutomobileIcon of a cloud with the letters IoT inside.Icon of a camera


MIPI UniPro® is a versatile transport layer that is used to interconnect chipsets and peripheral components in mobile-connected devices. It is a mature, general-purpose interface that is tailored to meet and respond to ongoing needs in mobile and other industries.  It was developed by the MIPI Alliance UniPro Working Group and first released in 2007. The current release, v1.8, was released in January 2018.

MIPI UniPro functions as a processing pipeline for data units. It is implemented on the MIPI M-PHY® physical layer and structured as a protocol stack, similar to layers 1-4 in an OSI reference model. The interface is easy to implement and flexible for use in traditional and modular device architectures. It is application-agnostic: It can be used as a standalone interface for chip-to-chip/IPC communications and as a building block for multimedia interfaces. Devices that use MIPI UniPro include smartphones, tablets, laptops, cameras, and multimedia devices; wearables such as smartwatches and health monitors;  augmented reality (AR) and virtual reality (VR) products; and infotainment platforms and telematics hubs used in automotive systems. 

MIPI UniPro can be implemented on as few as four wires. The current release, v1.8, operates on the most recent version of MIPI M-PHY, v4.1, to deliver data rates of up to 11.6 gigabits per second (Gbps) per lane—doubling the peak data transmission rate compared to the previous MIPI UniPro version. It provides quality of service (QoS) features, such as dynamic link updates and link training, to ensure components interconnected with the technology operate as intended at higher speeds.

The QoS features are expected to play an important role ensuring the reliability of data transmissions in systems that are subject to highly variable and potentially extreme temperature conditions, such as automobiles. The QoS features can also be used, in any application, to monitor and address performance issues associated with aging interconnects to help extend the lifespan of deployed systems.

Because of its versatility, MIPI UniPro has been adopted for traditional and innovative applications by both mobile and mobile-influenced industries. The JEDEC organization, which uses MIPI UniPro to provide the core integration technology for previous UFS standards, has adopted v1.8 to provide the interconnection layer for Universal Flash Storage (UFS) version 3.0 components deployed in smartphones, tablets, mobile computing products and automotive systems.  

MIPI Alliance is eager to work with members and other industry groups to further extend the reach of the specification in mobile and emerging platforms.

Note: The full specification is available only to MIPI Alliance members. For information about joining MIPI Alliance, visit Join MIPI.

Get the Specification

MIPI UniPro® v1.8
Member version


Current Version: 

v1.8 (January 2018)

Next Update: 
v2.0 (in development)