MIPI UniPro® is an application-agnostic transport layer that is used to interconnect chipsets and peripheral components in traditional or modular architectures. Because of its versatility, UniPro has been adopted for traditional and innovative applications in varied industries. For example, UniPro has been incorporated into multiple versions of the JEDEC Solid State Technology Association’s Universal Flash Storage (UFS) standard as its transport and link layers, along with MIPI M-PHY® serving as its physical layer.
MIPI UniPro is developed by the MIPI UniPro Working Group and was first released in 2007. The current version, v2.0, was adopted in 2022 and adds key features to double the data rate of the previous UniPro v1.8 specification, while offering greater throughput and reduced latency particularly required by today’s most demanding flash storage applications.
The full specification is available only to MIPI Alliance members. For information about joining MIPI Alliance, visit Join MIPI.