Developers in need of mobile flash storage solutions have long relied on the JEDEC Universal Flash Storage (UFS) standard because of its high performance and low power consumption. Serving as the “engine” behind UFS is MIPI UniPro® as its interconnect layer, and MIPI M-PHY® as its physical layer.
Earlier this year, new versions of both UFS (v3.0) and UniPro (v1.8) were released with significant new features. In this joint JEDEC-MIPI Alliance webinar, learn how these enhancements work together to enable new capabilities specifically for automotive, 5G and a wide variety of mobile applications.
Ramesh Hanchinal, UniPro WG Chair (Synopsys) As a staff engineer for Synopsys, Ramesh Hanchinal concentrates on PCIe, MIPI protocols (UniPro, M-PHY), universal verification methodology (UVM) and system verilog. He currently serves as chair of the MIPI UniPro Working Group and was a technical author of MIPI UniPro v1.61 and v1.8.
Bruno Trematore, JEDEC UFS TG Co-Chair (Toshiba Memory Corporation) Bruno Trematore is a chief engineer responsible for embedded memory standardization for Toshiba Memory Corporation and is co-chair of the JEDEC UFS TG. He also serves as liaison between MIPI and JEDEC on behalf of JEDEC JC-64.1.