Interested in an in-depth discussion of the I3C ecosystem and a look at the new features in MIPI I3C® v1.1? Join I3C Working Group Chair Ken Foust (Intel) for MIPI's second webinar of 2020, "Beyond Sensors: What's New in MIPI I3C v.1.1," on Wednesday, 12 February (08:00 Pacific).
Ken will compare v1.1's feature set with those of MIPI I3C v1.0 and I3C BasicSM v1.0 to help implementers choose the specification that best meets their needs. In addition, he will share the working group's plans for future development and provide a preview of related development efforts currently underway.
A principal engineer at Intel Corporation, Ken leads wired/wireless interconnect and sensing R&D initiatives within Intel Labs. In this capacity, he also works closely with standards bodies such as MIPI. Ken has been recognized with the MIPI Alliance Distinguished Service Award and as a Sensors Expo Engineer of the Year, and he is a member of the MSIG Technical Advisory Committee and Hall of Fame.
Join Matt Ronning (Sony), chair of the MIPI Automotive Working Group, and Raj Kumar Nagpal (Synopsys), vice chair of the MIPI PHY Working Group and lead of the A-PHY and D-PHY subgroups, on Wednesday, 4 March (08:00 Pacific) for an in-depth look at the forthcoming MIPI A-PHYSM, a high-speed, “long-reach“ (up to 15m) physical layer specification that will offer both high performance and simplified integration, along with the flexibility needed to suit a broad range of speed and design needs.