31 October 2017

• Keynote Presentations

  
  Our Future with Being Connected: IoT & Automotive with Flash Memory
  Presented by K.S. Pua, CEO, Phison Electronics Corp.
  

   

  MIPI M-PHY Gear 4 IP: Introduction & Challenges
  Presented by Vincent Cheng, R&D Director, Phison Electronics Corp.

• Track 1: MIPI Interfaces

  • MIPI I3C℠ Interface - Advanced Features (Lattice Semiconductor)
  • Building Intelligent, High-Speed Sensor Connectivity with MIPI I3C℠: Design Examples (Synopsys)
  • MIPI Alliance Extends Interface Standards to Support Automotive Market (MIPI Alliance)
  • ADAS High Bandwidth Imaging Implementation Strategies (Texas Instruments)

• Track 2: MIPI Verification and Test

  • Using the Protocol To Simplify PHY Testing: A Practical Example with UniPro℠ (BitifEye)
  • MIPI M-PHY® Gear4 and Its Impact on UniPort/UFS (Teledyne LeCroy)
  • MIPI I3C℠ High Data Rate Modes: How to Speed up Design Verification (Cadence Design Systems)
  • Practical Experiences in MIPI D-PHY℠ & C-PHY℠ Receiver Testing (Introspect Technology & Trust-Tek Corporation)
  • Next generation MIPI Physical Layer Design and Evaluation Challenges (Keysight Technologies)
  • MIPI High Speed Serial Technologies: Debug & Conformance Testing Challenges and Solutions (Tektronix)
  • Accelerating System Level Verification of SOC Designs with MIPI Interfaces (Cadence Design Systems)

• Track 3A: MIPI Interfaces for Imaging

  • Create Higher Resolution Displays With VESA Display Stream Compression (Hardent)
  • Driving 4K High-Resolution Embedded Displays in New Applications with MIPI DSI℠ and VESA DSC (Arm & Synopsys)
  • Mobile Influenced Markets – Evolution of Camera and Display Uses - Emerging Camera and Display Use Cases in Mobile Influenced Markets (Lattice Semiconductor)
  • Powering Imaging Applications with MIPI CSI-2℠ (Synopsys)
  • C-PHY℠/D-PHY℠ Combo Implementation and Use Case (Mixel, Inc. & Qualcomm Technologies, Inc.)
  • Enabling Higher Data Rates and Variety of Channels with MIPI D-PHY℠ (Synopsys)
  • Introduction and Overview of the New MIPI Touch Standard (Qualcomm Technologies, Inc.)

• Track 3B: MIPI Interfaces for Imaging

  • MIPI VGI for Sideband GPIO and Messaging Consolidation on Mobile System (Qualcomm Technologies, Inc. & Lattice Semiconductor)
  • IO Aggregation/De-Aggregation in Mobile and Mobile Influenced Systems to Improve Routing Congestion (Lattice Semiconductor)
  • Power, Performance and Security Advantages of UFS Leveraging MIPI Specifications (Synopsys)