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MIPI CSI-2 over D-PHY & C-PHY: Advancing Imaging Conduit Solutions

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MIPI CSI-2®, together with MIPI D-PHY™ and C-PHY™ physical layers, form the foundation of image sensor solutions across a wide range of markets, including smartphones, computing, automotive, robotics and beyond. Presented on 24 February 2026, this webinar explores the latest CSI-2 feature developments and the continued evolution of MIPI’s low-energy, high-performance physical layer transport solutions–D-PHY and C-PHY–which leverage differential and ternary signaling, respectively. 

The webinar offers insight into recently adopted capabilities such as event-based sensing and processing, as well as D‑PHY embedded clock mode. It also covers near-term enhancements, including dual-PHY macro support and multi-drop bus capability, along with a forward-looking view of longer-term feature developments. By the close of the webinar, you'll understand how MIPI imaging solutions are enabling next-generation computer and machine vision applications across a wide range of product ecosystems.

 
 

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