Dervla O'Reilly, MIPI Senior Event Manager
Returning to its most-visited meeting city to date, MIPI Alliance welcomed 142 participants from more than 50 companies to Taipei last month for Member Meeting #73. Members gathered at the Grand Hyatt Taipei, 19-23 October, to collaborate among 16 groups, including the board of directors, Technical and Marketing steering groups, 12 working groups and the Audio Device Class subgroup.
Read on to review highlights from the special events in Taipei. If you're a MIPI member, watch your inbox for the post-Taipei meeting report with additional details about working group timelines, along with an updated MIPI Specification Roadmap.
Technical Insights and New Leadership
Before the meeting officially launched on Tuesday morning, MIPI working group leaders and the board of directors convened on Monday for a Technical Steering Group (TSG) session, which covered a range of cross-group technical discussions, including potential compliance testing beyond MIPI A-PHY, exploration of low/middle-speed I/O aggregation, use of AI tools and the Software Working Group's gap analysis.
The 73rd meeting officially got underway at the Opening Plenary on 20 October with a welcome from Peter Lefkin, MIPI executive director, and the introduction of the recently appointed co-chairs of the MIPI Board of Directors: Gaurav Arora (Google) and Aruni Nelson (Intel Corporation).
Peter began by recognizing new Contributor attendees and member companies based in Taiwan, followed by additional leadership announcements, including the appointments of Rick Wietfeldt (Qualcomm Incorporated) and Tilman Gloekler (Robert Bosch GmbH) to the chair and vice chair roles of the new Kinematics Working Group; and Ankur Bal (STMicroelectronics) to the chair role of the Die-to-Die Birds of a Feather (BoF) group.
Strengthening Membership Value and the MIPI Community
Peter then shared a progress report on MIPI's five strategic pillars: strategic roadmap development, enablement, adoption, strategic direction, and membership growth and value. He also previewed the member survey component of MIPI's ongoing Membership Value and Structure Analysis, an important initiative developed to strengthen member value, participation and specification adoption.
New board co-chair Aruni Nelson followed with a celebration of the MIPI community and the people behind every specification. She reflected on the qualities—such as discipline, courage, humility and patience—required to develop shared solutions that empower all members to build better products. She closed by encouraging members to bring their technical requirements to MIPI, make room for other voices and opinions, and help grow MIPI expertise by mentoring others.
Working Group Updates
TSG Chair Ariel Lasry (Qualcomm Incorporated) presented the latest specification roadmap updates since the June member meeting, including the newly adopted MIPI A-PHY v2.1 and MIPI Debug Over USB v1.2, plus new work on DBI-2 v3.0, Debug Over PLDM and A-PHY v2.2. He also shared progress on TSG strategic topics such as time synchronization, low power and a new AI tools subgroup.
Software Working Group Chair Jon Eklund (Cirrus Logic) described the group's refocused role under its new charter and software policy, both board-approved in June. Under the new model, working groups are responsible for their own hardware/software stacks, while the Software Working Group guides MIPI-wide policy, common frameworks and strategy. Jon also shared early findings from the software gap analysis and highlighted current MIPI software tools available on the public MIPI Alliance GitHub platform.
Physical AI BoF Chair Edo Cohen (Valens Semiconductor) provided a checkpoint on the Physical AI BoF, which has grown to 133 participants from 67 companies in 21 countries since kicking off in the spring. Edo outlined why humanoid robots are a key opportunity for MIPI specifications, shared results from a MIPI humanoid survey and previewed a proposed MIPI humanoid framework.
Rob Anhofer, MIPI director of operations, closed out the updates with an overview of MIPI's first🔒 Artificial Intelligence Usage and Conduct Guidelines, approved by the board in July. The guidelines define how AI technology may be used across MIPI groups and activities.
Specification Award: MIPI CCPAL/U
The Opening Plenary wrapped with recognition of members who contributed to the development of the CSI-2 & CCI Protocol Adaptation Layer Specification for eUSB2V2 (MIPI CCPAL/U). Peter recognized working group leaders Nadav Banet (Valens Semiconductor), Sophie Fu (Advanced Micro Devices, Inc.), Timo Kaikumaa (Intel Corporation), Ariel Lasry (Qualcomm Incorporated), Adi Menachem (Qualcomm Incorporated) and Joe Scanlon (Advanced Micro Devices, Inc.) with specification plaques; and all members who contributed to the specification will receive an award certificate.
Download the Opening Plenary presentation » (MIPI members only)
MIPI Plugfest: Hands-On I3C Testing
In conjunction with the meeting, MIPI hosted an I3C Plugfest on Monday and Tuesday, giving implementers of the MIPI I3C family of specifications a confidential setting to test interoperability between controller and target devices. The event drew 51 participants from 17 companies—a new record for plugfest participation.
Demo Day: Member Solutions and MIPI Education
The week's busiest day came on Wednesday as MIPI Demo Day Taipei welcomed more than 250 attendees, including Member Meeting #73 participants, to see 16 member demos showcasing products and solutions built on MIPI specifications, and attend four MIPI education sessions led by working group chairs and technical experts.
Participating companies included Acute Technology Inc.; Arasan Chip Systems, Inc.; Binho LLC; BitifEye Digital Test Solutions GmbH; Genesys Logic, Inc.; Introspect Technology; Keysight Technologies Inc.; MAXVY Technologies Pvt. Ltd.; Mixel, Inc., a Silvaco Company; Prodigy Technovations Pvt. Ltd.; Protocol Insight, LLC; Silicon Line; Soliton Technologies Private Limited; Synopsys, Inc.; Tektronix, Inc.; and Teledyne LeCroy.
Education sessions covered the latest developments across the MIPI I3C, I/O Bridges, A-PHY, SWI3S, DSI-2 and DCS specifications. The following presentations from MIPI Demo Day Taipei are now available to download:
- MIPI I3C Developments and New MIPI Specification for I/Os Over I3C Bridge
Presenters: Eyuel Zewdu Teferi and Aruni Nelson - MIPI A-PHY: New Compliance Program and Recent Specification Developments
Presenters: Edo Cohen and Tom Kopf - Exploring MIPI SWI3S: Features, Applications, Tools and What's Next
Presenter: Aruni Nelson - What's Coming in MIPI DSI-2 v3.0 and DCS v3.0
Presenter: Samson Kim
In addition, MIPI experts Edo Cohen, Ian Smith and Peter Lefkin shared a market and technology overview at at Demo Day media briefing, which drew 18 local journalists to learn more about MIPI specifications and application areas such as automotive and humanoids.
Networking and Social Evenings in Taipei
After Tuesday's working group sessions wrapped, attendees gathered for a networking reception with light canapés and drinks. On Wednesday evening, following Demo Day, members took a midweek break at a social reception on the hotel's terrace, enjoying cocktails, dinner and views of the city.
Join Us for Member Meeting #74 in San Francisco
Contributor and Board members are invited to attend MIPI's next member meeting, 1-5 March 2027, at the Hilton San Francisco Union Square. Adopter members can learn more about attending by participating in the February-April 2027 trial period of the Contributor Trial Membership Program.