Join MIPI
Join MIPI
    Demo-Day

     

       

       

      MIPI Demo Day Taipei 2026

       

      21 October 2026

      MIPI Demo Day Taipei Education Sessions

      Education Sessions

      教育研討會

       

      In addition to the 16 member companies showcasing their innovative solutions, MIPI Demo Day Taipei will also deliver education presented by MIPI working group chairs and technical experts. These four sessions will diving into the latest developments and a look ahead at what's next for MIPI Display, A-PHY®, SWI3S®, and I3C®.

      除了 16 家 MIPI 會員公司將於活動現場展示創新解決方案外,當日也將舉辦四場教育研討會,由 MIPI 工作小組主席與技術專家到場分享,深入探討 MIPI Display、A-PHY®、SWI3S® 及 I3C® 的最新發展與未來方向。

       

      MIPI I3C Developments and New MIPI Specification for I/Os Over I3C Bridge

      Presenters: Eyuel Zewdu Teferi, Aruni Nelson

      10:30-11:15 a.m. 

      The first part of this presentation will provide an update on the latest developments in MIPI I3C®, covering advanced features such as HDR modes, multilane communication, target reset and I²C backward compatibility. It will also preview upcoming I3C v1.3 enhancements, including extended-length buses, multi-bus bridging, data protection and functional safety, highlighting the new applications they enable.

      The second part of the presentation will introduce the forthcoming MIPI Specification for I/Os Over I3C Bridge. The new specification will standardize the bridging of I²C, SPI, UART and GPIO interfaces over MIPI I3C to reduce pin count, simplify system design, improve interoperability and extend the life of existing peripheral devices. This part will conclude with a look ahead at future deliverables from the MIPI I/O Bridges Working Group.

      MIPI I3C發展暨最新 I/Os over I3C橋接規格

      講者:Eyuel Zewdu Teferi、Aruni Nelson

      上午10:30–11:15

      研討會第一部分將帶來 MIPI I3C® 最新發展,介紹包含 HDR 模式、多通道通訊、目標裝置重置與 I²C 向下相容性等進階功能。

      同時也將搶先介紹將於 I3C v1.3 導入的強化功能,包括延伸匯流排長度、多匯流排橋接、資料保護與功能安全,並說明這些新功能可望支援的應用情境。

      第二部分將介紹即將推出的 MIPI I/Os Over I3C 橋接規格。

      這項新規格將建立MIPI I3C 橋接 I²C、SPI、UART 與 GPIO 介面的標準化機制,可協助系統開發人員減少接腳數量、簡化系統設計、提升互通性,並延長既有周邊裝置的使用壽命。

      最後,講者也將分享 MIPI I/O Bridges工作小組後續規劃,以及未來預計推出的相關技術成果。

      Presenters

      講者 

      MIPI A-PHY: New Compliance Program and Recent Specification Developments

      Presenters: Edo Cohen, Tom Kopf
      11:15 a.m.–12 p.m. 

      This presentation will provide the latest insights into the MIPI A-PHY® specification and the new MIPI A-PHY Compliance Program, which supports its continued industry adoption. The session will begin with an overview of the latest developments in MIPI’s high-speed, long-reach SerDes interface, including the release of A-PHY v2.1. It will highlight key advances across the A-PHY ecosystem, including growing industry adoption, strategic collaborations and emerging implementations. Next, the presentation will introduce the MIPI A-PHY Compliance Program, explaining its structure, processes and benefits. Attendees will learn how transmitter and receiver physical layer testing supports broader industry adoption and enables the reliable, scalable deployment of A-PHY-enabled devices in automotive architectures.

      The presentation will conclude with an opportunity for attendees to engage with the speakers and discuss the latest developments in the A-PHY ecosystem.

      MIPI A-PHY:全新相容性認證計畫與近期規格發展

      講者:Edo Cohen、Tom Kopf
      上午 11:15–中午 12:00

      本場研討會將深入介紹 MIPI A-PHY® 規格的近期發展,以及全新的 MIPI A-PHY 相容性認證計畫,推動 A-PHY 在產業中的持續導入。內容將涵蓋 MIPI 高速、長距離 SerDes 介面的最新發展,包括近期發布的 A-PHY v2.1,並分享 A-PHY 生態系的重要進展,如產業採用持續成長、策略合作,以及新興應用與實作案例。研討會也將說明 MIPI A-PHY 相容性認證計畫的架構、流程與效益,並探討如何透過傳送端與接收端的實體層測試,提升產品互通性與可靠度,進一步支援 A-PHY 裝置在車用架構中的可靠且可擴展部署。活動最後將安排交流時間,讓與會者可直接與講者討論 A-PHY 生態系的最新技術與產業發展。

       

      Presenters

      講者

      Exploring MIPI SWI3S: Features, Applications, Tools and What's Next

      Presenter: Aruni Nelson
      1:30–2:15 p.m. 

      The MIPI SWI3S® v1.0 specification defines a low-latency, multi-drop audio interconnect with bandwidth up to 76 Mbps, supporting both single-ended and differential-low-voltage signaling modes through a unified protocol and software stack. Designed for applications ranging from compact wearables to automotive and robotics, the specification features low-voltage, embedded-clock signaling for reduced EMI/EMC and long cable support.

      This presentation will cover SWI3S use cases, architecture, protocols, command flows and key improvements over existing audio interfaces. It will also provide an overview of supporting tools such as the SWI3S visualizer and a preview of the forthcoming Audio Bus Controller Interface (ABCI) and planned enhancements expected in SWI3S v1.1.

      MIPI SWI3S技術解析:功能、應用、工具與未來發展

      講者:Aruni Nelson
      下午 1:30–2:15

      MIPI SWI3S® v1.0 定義了一套低延遲、多點連接(Multi-drop)的音訊互連介面,頻寬最高可達 76 Mbps,透過統一的協定與軟體堆疊,同時支援單端與差動低電壓訊號模式。SWI3S 可應用於從小型穿戴式裝置到汽車與機器人系統等多種情境。採用低電壓及嵌入式時脈訊號設計,有助於降低 EMI/EMC,同時支援較長距離的纜線連接。本場研討會將深入介紹 SWI3S 的應用情境、架構、協定與指令流程,並解析相較於現有音訊介面的主要技術改進。講者也將分享 SWI3S Visualizer 等相關支援工具,搶先介紹即將推出的 Audio Bus Controller Interface(ABCI),以及預計於 SWI3S v1.1 導入的後續強化功能。

      Presenter
      講者

      What's Coming in MIPI DSI-2 v3.0 and DCS v3.0

      Presenter: Samson Kim
      2:15–3 p.m. 

      The upcoming releases of MIPI DSI-2™ v3.0 and MIPI DCS™ v3.0 will introduce new capabilities for next-generation displays, with a focus on low-power operation and emerging AR applications. This session presents the latest enhancements, including partial update in video mode, field-sequential display support, command mode peripheral sync synchronization, frame synchronized single wire peripheral to host (P2H) sideband interface, line group sequential support, multipoint support, and new DCS commands for partially refreshed displays.

      The presentation will provide insight into the technical motivation, implementation considerations and benefits of these new features, explaining how they can enable more efficient display architectures in preparation for AR- and 6G-ready applications.

      搶先看 MIPI DSI-2 v3.0 與 DCS v3.0 最新功能

      講者:Samson Kim
      下午 2:15-3:00

      即將推出的 MIPI DSI-2™ v3.0 與 MIPI DCS™ v3.0,將為下一代顯示系統導入多項新功能,重點涵蓋低功耗運作與新興 AR 應用。本場研討會將介紹最新規格強化內容,包括:視訊模式下的局部更新、場序式顯示(Field-Sequential Display)支援、命令模式周邊裝置同步、影格同步單線式周邊裝置至主機旁帶介面、線群循序(Line Group Sequential)支援、多點連接支援、針對局部更新顯示器新增的 DCS 指令。講者將進一步說明新功能背後的技術設計考量、實作考量與效益,並解析如何協助打造更有效率的顯示架構,為未來 AR 與 6G 應用做好準備。

      Presenter

      講者