27 October

T1 MIPI Sensor and Sideband Interfaces

• 10:15 | (T1) MIPI I3C Interface - Advanced Features (Qualcomm)

  Download the presentation »

  Abstract: The MIPI I3C bus is an intelligent serial interface, with flexible bus management architecture. It aims at enhancing the benefits of speed and energy efficiency of the data transfer by adding several features that streamline various type of transactions. In addition, those features are designed to facilitate the System Design, providing scalable and efficient interconnectivity solutions. The System Designers challenges and their wish-lists were taken in consideration, materializing into the comprehensive list of I3C features. The Flow Control and the Timing Control tools provided by MIPI I3C interface are the subject of this presentation. Elements of solved problems, their challenges and practical aspects are included.

  Radu Pitigoi-Aron is a System Architect at Sensors Advanced Technology Group of Qualcomm Technologies, Inc. Radu works on next generation of Mobile and Internet Devices, empowered by the intelligent use of information gathered from sensors, traditional and ground breaking. He is Contributor to MIPI I3C Interface and has been presented with the Specification Award for his work on Version 1.0. Before joining Qualcomm, Radu held several Lead Project positions, across three continents, in Romania, South Africa and lately in USA. He has covered a wide spectrum, including classical Analog design, real-time digital/analog embedded systems, intelligent lighting controllers, system architecture. He received a M.S. in Electronics Engineering from Polytechnic Institute of Bucharest, Romania. Radu is the holder of 23 USA Patents on Electronics topics.

   

  

   

• 10:45 | (T1) A Developer's Guide to MIPI I3C Implementation and MIPI I3C Beyond Sensors (Intel)

  Download the presentation »

  Abstract: Preparing to implement MIPI’s new sensor interface, MIPI I3C, in your next design? Curious about MIPI I3C's proliferation beyond basic sensing? This presentation will provide adopters of MIPI I3C with targeted guidance on how to ensure a successful and efficient implementation of I3C in their mobile and mobile-influenced products. Leveraging I2C as a foundation, many components of I3C will be familiar to implementers, but with guidance provided here, attendees will leave with a clearer understanding of I3C’s key innovative features, how they will improve their systems and what considerations should be made to fully leverage them. Implementation guidance will include, but not be limited to support for legacy I2C devices, understanding network topology tradeoffs and good design practices.

  Ken Foust, Intel Corporation is a Sensor Technologist and Researcher who leads sensing initiatives across Intel’s product portfolio and R&D labs. He is also the Chair of the MIPI Sensor Working Group. Previously, Ken was a Director at Kionix, Inc., started his career at IBM and received a BSEE from Alfred University.

   

  

   

• 11:15 | (T1) Building Intelligent, High-Speed Sensor Connectivity with MIPI I3C – Design Examples (Synopsys)

  Download the presentation »

  Abstract: MIPI I3C enables multiple sensor connectivity using a single integrated bus with minimal pin count and throughput up to 33 Mbps. This presentation briefly describes I3C and its key features, and through examples details how I3C can be used in IoT and automotive systems to enable a more intelligent sensor connectivity. I3C provides lower cost, lower power and better scalability than I2C and other interfaces, making it ideal for sensor and non-sensor applications such as touch. Hear how you can integrate the unique benefits of I3C into SoCs and systems with compliant MIPI IP.

  Sriram Balasubramania is a Director of R&D at Synopsys. He has more than 25 years of VLSI design experience with a focus on connectivity protocols. Mr. Balasubramanian’s primary interest and area of work are in products based on MIPI, JEDEC, USB and SD standards. Mr. Balasubramanian holds a BTech degree in Electronics and Communication Engineering from Calicut University India and an MBA from Indian Institute of Management, Bangalore. 

   

  

   

• 11:45 | (T1) MIPI VGI for Sideband GPIO and Messaging Consolidation on Mobile System (Qualcomm Technologies, Inc. & Lattice Semiconductor)

  Download the presentation »

  Abstract: In a typical mobile influenced system a large number of sideband GPIOs are used which add to package size and cost. FSM based MIPI VGI aims to consolidate these sideband GPIOs and low speed messaging over a 2- or 3-wire interface. VGI FSM could also be used behind a suitable serial interface, such as I3C. MIPI VGI v1.0 spec is nearing its completion and is expected to be released next year.

  Lalan Mishra has over 25 years of design and innovation experience in the field of Wireless Embedded Systems (Smartphones/Tablets/eBook etc.), Lalan is currently employed with Qualcomm Inc. as Principal Engineer - Advanced Connectivity Technology. In his current role, Lalan focuses on conceiving next-generation chipset connectivity architecture involving digital and RF circuits with the goal to minimize cost, power, latency and pin-count. Lalan conceived the idea of Virtual GPIO Interface (VGI) back in 2012 and this concept is now in the standardization process at MIPI under the umbrella of Reduced Input-Output Work-Group (RIO-WG), chaired by him. Lalan has 11 patents (issued) and 118 patents (pending) to his credit. He holds a Master’s degree from UCSD with specialization in Wireless Embedded Systems. In his spare time, he loves to dive into Natural Philosophy and plays classical ragas on Indian bamboo flute.

  Satwant Singh is the Senior Director of Strategic Planning at Lattice Semiconductor, where he is responsible for ecosystem involvement for new developments and Lattice’s product capabilities roadmaps. Singh serves as the Vice Chair of MIPI Alliance’s RIO Working Group, as well as for the MIPI Sensor Working Group focused on developing new I3C interface specification. Singh holds a master’s of science in Electrical Engineering from the University of Toronto and has more than 30 patents.Satwant Singh is the Senior Director of Strategic Planning at Lattice Semiconductor, where he is responsible for ecosystem involvement for new developments and Lattice’s product capabilities roadmaps. Singh serves as the Vice Chair of MIPI Alliance’s RIO Working Group, as well as for the MIPI Sensor Working Group focused on developing new I3C interface specification. Singh holds a master’s of science in Electrical Engineering from the University of Toronto and has more than 30 patents.