MIPI Alliance Specifications
MIPI Alliance offers a comprehensive portfolio of specifications to interface chipsets and peripherals in mobile-connected devices. The specifications can be applied to interconnect a full range of components—from the modem, antenna and application processor to the camera, display, sensors and other peripherals. Manufacturers use the specifications to optimize performance, simplify the design process, reduce development costs, create economies of scale for their designs, and shorten time-to-market for their products.
Companies from across the mobile industry have adopted MIPI Alliance specifications. Every smartphone uses at least one MIPI Alliance interface and the solutions are commonly used in tablets and laptops. Companies in many vertical markets are also adopting MIPI Alliance specifications for current and future designs. Connected cars developed by automotive firms and wearables offered by sports and healthcare companies illustrate the range of devices and business ecosystems that benefit from MIPI Alliance specifications.
MIPI Alliance specifications serve six types of interface needs in a device: physical layer, multimedia, chip-to-chip/interprocessor communications (IPC), device control and data management, system debugging, and software integration.
Each specification is optimized to address three fundamental performance characteristics:
- low power to preserve battery life,
- high-bandwidth to enable feature-rich, data-intensive applications, and
- low electromagnetic interference (EMI) to minimize interference between radios and device subsystems.
MIPI Alliance offers its specifications as individual interfaces, enabling companies to use those that suit their own particular needs. Vendors can apply the interfaces with their own high-level features to provide added value or differentiate their products.
- Physical layer—A family of high-speed physical layers to serve essential interconnection needs in a device
- Multimedia—Protocols for camera and imaging, display and touch, and a complete interface for audio
- Chip-to-chip/IPC—Protocol layers for chip-to-chip or interprocessor communications
- Control and data—Interfaces to manage lower-speed components
- Debug and trace—Tools for debugging embedded systems throughout the development lifecycle
- Software integration—Tools that streamline software integration of components in mobile-connected products