MIPI Alliance Specifications
MIPI Alliance offers a comprehensive portfolio of specifications to interface chipsets and peripherals in mobile-connected devices. The specifications can be applied to interconnect a full range of components—from the modem, antenna and application processor to the camera, display, sensors and other peripherals. Manufacturers use the specifications to optimize performance, simplify the design process, reduce development costs, create economies of scale for their designs, and shorten time-to-market for their products.
Companies from across the mobile industry have adopted MIPI Alliance specifications. Every smartphone uses at least one MIPI Alliance interface and the solutions are commonly used in tablets and laptops. Companies in many vertical markets are also adopting MIPI Alliance specifications for current and future designs. Connected cars developed by automotive firms and wearables offered by sports and healthcare companies illustrate the range of devices and business ecosystems that benefit from MIPI Alliance specifications.
MIPI Alliance specifications serve six types of interface needs in a device: physical layer, multimedia, chip-to-chip/interprocessor communications (IPC), device control and data management, system debugging, and software integration.
Each specification is optimized to address three fundamental performance characteristics:
- low power to preserve battery life,
- high-bandwidth to enable feature-rich, data-intensive applications, and
- low electromagnetic interference (EMI) to minimize interference between radios and device subsystems.
MIPI Alliance offers its specifications as individual interfaces, enabling companies to use those that suit their own particular needs. Vendors can apply the interfaces with their own high-level features to provide added value or differentiate their products.
The specifications are available to MIPI Alliance members only. For information about joining MIPI Alliance, see Join MIPI.
- Physical layer—A family of high-speed physical layers to serve essential interconnection needs in a device
- Multimedia—Protocols for camera and imaging, display and touch, and a complete interface for audio
- Chip-to-chip/IPC—Protocol layers for chip-to-chip or interprocessor communications
- Control and data—Interfaces to manage lower-speed components
- Debug and trace—Tools for debugging embedded systems throughout the development lifecycle
- Software integration—Tools that streamline software integration of components in mobile-connected products
Camera and Imaging
MIPI CCS℠ v1.0, MIPI Camera Command Set, 24-Oct-2017
MIPI CSI-2℠ v2.1, MIPI Camera Serial Interface 2, 9-Apr-2018
MIPI CSI-3℠ v1.1, MIPI Camera Serial Interface 3, 12-Mar-2014
MIPI CPI℠ v1.0, MIPI Camera Parallel Interface, 23-Mar-2004
MIPI CSI℠ v1.0, MIPI Camera Serial Interface, 23-Mar-2004
Control and Data
MIPI BIF℠ v1.1.1, MIPI Battery Interface, 10-Mar-2015
MIPI BIF℠ Hardware Abstraction Layer v1.0, 22-May-2013
MIPI eTrak℠ v1.1, MIPI Envelope Tracking Interface, 10-Sep-2014
MIPI I3C℠ v1.0, MIPI Improved Inter Integrated Circuit, 31-Dec-2016
MIPI RFFE℠ v2.1, MIPI RF Front-End Control Interface, 23-April-2018
MIPI SPMI℠ v2.0, MIPI System Power Management, 28-Aug-2012
Debug and Trace
MIPI Gigabit Debug for IPS v1.0, 29-Jul-2016
MIPI Gigabit Debug for USB v1.1, 2-Mar-2018
MIPI HTI v1.0, MIPI High-Speed Trace Interface (MIPI HTI), 29-Jul-2016
MIPI NIDnT℠ v1.2, MIPI Narrow Interface for Debug and Test, 5-Dec-2017
MIPI PTI℠ v2.0, MIPI Parallel Trace Interface, 12-Oct-2011
MIPI SPP℠ v1.0, MIPI SneakPeek Protocol, 3-Aug-2015
MIPI STP℠ v2.2, MIPI System Trace Protocol, 11-Feb-2016
MIPI SyS-T℠ v1.0, MIPI System Software – Trace, 9-Apr-2018
MIPI TWP℠ v1.1, MIPI Trace Wrapper Protocol, 18-Dec-2014
Display and Touch
MIPI ALI3C℠ v1.0, MIPI Adaptation Layer for I3C, 09-Apr-2018
MIPI DBI℠ v1.0, MIPI Display Bus Interface, 22-Mar-2004
MIPI DBI-2℠, MIPI Display Bus Interface 2, 16-Nov-2005
MIPI DCS℠ v1.4, MIPI Display Command Set, 2-May-2018
MIPI DPI-2℠ v2.00, MIPI Display Pixel Interface 2, 23-Jan-2006
MIPI DPI℠ v1.0, MIPI Display Pixel Interface, 23-Mar-2004
MIPI DSI-2℠ v1.1, MIPI Display Serial Interface 2, 2-May-2018
MIPI DSI℠ v1.3.1, MIPI Display Serial Interface, 17-Dec-2015
MIPI SDF℠ v1.0, MIPI Stereoscopic Display Formats, 14-Mar-2012
MIPI TCS℠ v1.0, MIPI Touch Command Set, 09-Apr-2018
MIPI DDB℠ v1.0, MIPI Device Descriptor Block,12-Oct-2011
MIPI DisCo℠ v1.0, MIPI Discovery and Configuration (DisCo) Specification, 28-Dec-2016
MIPI DisCo Specification for NIDnT, 24-Oct-2017
MIPI DisCo Specification for SoundWire v1.0, 28-Mar-2017
MIPI I3C℠ HCI℠ v1.0, 29-Sep-2017
MIPI Alliance specifications are developed by technical working groups that focus on specific market needs for interface technologies. Participants in each working group are international experts in the field of interest. Participants typically represent semiconductor companies, software vendors, IP providers, peripheral manufacturers, test labs and end-product OEMs.
Technical working groups are formed by the MIPI Alliance Board of Directors based on the recommendations of internal investigation groups or birds-of-a-feather groups. Once a working group is formed, it establishes a development roadmap and timeline that allow for plenty of dialog and discussion as the specification is drafted. Companies that are contributor members and above can participate in working groups.
A separate set of strategic working groups is in place to help provide guidance to the board and the technical working groups on marketing, technology development, and test-related activities.
Active Technical Working Groups
- Audio Working Group
- Automotive Working Group
- Camera Working Group
- Debug Working Group
- Display Working Group
- PHY Working Group
- Reduced Input Output (RIO) Working Group
- RF Front End Working Group
- Sensor Working Group
- Software Working Group
- UniPro Working Group
Advisory Working Groups