2 min read
MIPI C-PHY™, the ternary-based, high-performance, low-power and low electromagnetic interference (EMI) interface specification for connecting cameras and displays, recently got an upgrade to v3.0. This latest version introduces support for an...
2 min read
Dervla O'Reilly, MIPI Senior Event Manager: 22 November 2023
You're invited to join us on 27-29 November for MIPI's Camera Week webinar series–two webinars exploring the system architecture implications of using MIPI CSI‑2® over C‑PHY℠ and D‑PHY℠, and a member use case on how CSI-2 can deliver optimum image...
1 min read
Sharmion Kerley, MIPI Director of Marketing and Membership: 2 September 2021
MIPI Alliance’s family of specialized, point-to-point, physical layer (PHY) serial interfaces support a variety of chip-to-chip, chip-to-camera and chip-to-display applications that require high bandwidth, low power and low electromagnetic interference...
5 min read
Mohamed Hafed, Ph.D., CEO at Introspect Technology: 18 May 2020
The latest trend for semiconductor device manufacturers is to add several high-speed MIPI® specification-based ports to a single device. This enables feature-rich implementations of imaging- and display-intensive applications, although it also poses...
5 min read
Brad Biddle, MIPI Counsel: 9 January 2020
MIPI Alliance periodically receives questions about how its legal policies apply in different circumstances. This post addresses questions we’ve received about the requirement that MIPI protocols be used only with MIPI PHYs. The post explains existing...
2 min read
Henrik Icking, Raj Kumar Nagpal and George Wiley, MIPI PHY Working Groups Chairs and Leads: 26 November 2019
MIPI Alliance has recently released new versions of its two physical layer specifications designed for high-performance, cost-optimized cameras and displays. MIPI C-PHYSM v2.0, released in September 2019, and MIPI D-PHYSM v2.5, released in October,...
