• This webinar provides an in-depth look at the forthcoming MIPI A-PHY℠, a high-speed, “long-reach“ (up to 15m) physical layer specification that will allow native connections to the widely implemented CSI-2 and DSI-2 protocols. The goal is to provide the automotive industry with a standardized approach that offers both high performance and simplified integration, along with the flexibility needed to suit a broad range of speed and design needs.
  • This webinar showcases the many new features and capabilities enabled by MIPI I3C® v1.1, the first update to the ground-breaking I3C bus interface designed to eliminate the historical pain points of I2C development.
  • MIPI Webinar - The New frontier of MIPI CSI-2 Camera and Imaging Applications: Leveraging the Power of Machine Vision for Mobile, IoT, Client Devices, Automotive and Beyond presented by Haran Thanigasalam, chair of the MIPI Camera Working Group.  
  • Ramesh Hanchinal, UniPro WG Chair (Synopsys), and Bruno Trematore, JEDEC UFS TG Co-Chair (Toshiba Memory Corporation)
  • MIPI Webinar - Evolution of MIPI CSI-2 Imaging Conduit presented by Haran Thanigasalam, chair of the MIPI Camera Working Group.  
  • Presented by Matt Ronning, chair, MIPI Automotive Working Group & Uwe Beutnagel-Buchner, vice chair, MIPI Automotive Working Group
  • Presented by Ken Foust, Intel Corporation. Ken is the sensor technologist and researcher who leads sensing initiatives across Intel’s product portfolio and R&D labs.
  • Presented by Mikko Muukki, Huawei. Mikko is the technical lead for MIPI CCS and an expert in imaging and video technology at Huawei.  
  • Presented by Robert Gough, Intel Corporation, Chair of Software Working Group
  • Presented by Dale Stolitzka, Samsung Display Co. & Chair of the MIPI Display Working Group.
  • Presented by Jason Peck, Texas Instruments & vice chair of the MIPI Debug Working Group.
  • Presented by Lalan Mishra, Qualcomm Technologies, Inc. and Satwant Singh, Lattice Semiconductor, both vice chairs of the MIPI RIO Working Group.
  • Presented by Haran Thanigasalam, Intel Corporation & Chair of the MIPI Camera Working Group.
  • Presented by Jürgen Urban, Toshiba & Chair of the MIPI UniPro Working Group.
  • Presented by Jim Ross, Skyworks Solutions (Chair MIPI RFFE WG) and John Oakley, Intel Corporation (Vice-chair MIPI RFFE WG)
  • Presented by Pierre Bossart, Principal Engineer in the Intel Open-Source Technology Center and Chair of MIPI LML Working Group.