Webinars

Use of video compression will be essential to address the proliferation of high-performance displays in next-generation mobile, AR/VR and automotive use cases. This webinar will provide a guide to the two video compression standards, VESA VDC-M and VESA DSC, that are adopted into the MIPI DSI-2℠ specification.  

This webinar focuses on the display components of the MASS framework, providing an overview of each component and explaining how they combine to provide an end-to-end connectivity solution for the next generation of advanced, high-performance, automotive displays. 

Following on from the recent MIPI webinar –  MIPI Debug for I3C: The Next Generation Debug Interface (view recording) – this webinar will go to the next level of detail to provide a technical “deep dive” into the specification.

Aimed at engineers who would like to get started with MIPI Debug solutions, this webinar will provide an introduction to the overall MIPI debug system framework, explaining how MIPI debug breaks down modern system-on-chip (SoC) debug architectures into manageable debug subsystems. This webinar will also run through each of the component parts of the MIPI debug system, providing an overview of each component within the layered framework.

In this webinar, Sakari Ailus, member of MIPI Camera Working Group and software engineer at Intel, will provide an overview of the components of MIPI CCS Tools. The webinar will also include a demonstration of the CCS Tools and the Linux CCS driver.

This webinar includes a discussion of industry needs and requirements, MIPI A-PHY’s fit with other wired connectivity technologies, and a roadmap to how this specification can be leveraged in the near term as well as in the future.

In this webinar you will hear how MIPI Debug for I3C addresses the shortcomings of current solutions based on JTAG/cJTAG, I2C and UART, which are statically structured and lead to limited scalability and accessibility of debug components/devices. The webinar will also explain how MIPI Debug for I3C meets the requirements of new technologies such as 5G, and new markets such as IoT, where there are new and specific debug requirements that need to be addressed.   

MIPI A-PHY v1.0, the much anticipated serializer-deserializer (SerDes) physical layer interface designed to support ADAS, ADS, IVI and other surround-sensor applications, is now in its final approval phase, with release expected within 90 days. The first asymmetric "long reach" standard of its kind, MIPI A-PHY serves as the foundation of an even larger system solution that will ultimately incorporate functional safety and security. With the ability to span an entire vehicle (up to 15m) at high speeds and support native connections to upcoming versions of MIPI’s camera and display interfaces (CSI-2 and DSI-2, as well as third-party protocols), this new specification will significantly simplify integration by eliminating the “bridge” solutions needed today.

In this webinar, find out how the new version of MIPI RFFE (v3.0) addresses these challenges with new triggering features designed to deliver tighter precision and reduced latencies in the control of RFFE subsystems. You’ll also learn how these various types of triggers work together to improve performance and to switch quickly among the various bands and band combinations in a 5G system.

This webinar provides an in-depth look at the forthcoming MIPI A-PHY℠, a high-speed, “long-reach“ (up to 15m) physical layer specification that will allow native connections to the widely implemented CSI-2 and DSI-2 protocols. The goal is to provide the automotive industry with a standardized approach that offers both high performance and simplified integration, along with the flexibility needed to suit a broad range of speed and design needs.

This webinar showcases the many new features and capabilities enabled by MIPI I3C® v1.1, the first update to the ground-breaking I3C bus interface designed to eliminate the historical pain points of I2C development.

MIPI Webinar - The New frontier of MIPI CSI-2 Camera and Imaging Applications: Leveraging the Power of Machine Vision for Mobile, IoT, Client Devices, Automotive and Beyond presented by Haran Thanigasalam, chair of the MIPI Camera Working Group.  

Ramesh Hanchinal, UniPro WG Chair (Synopsys), and Bruno Trematore, JEDEC UFS TG Co-Chair (Toshiba Memory Corporation)

MIPI Webinar - Evolution of MIPI CSI-2 Imaging Conduit presented by Haran Thanigasalam, chair of the MIPI Camera Working Group.  

Presented by Matt Ronning, chair, MIPI Automotive Working Group & Uwe Beutnagel-Buchner, vice chair, MIPI Automotive Working Group

Presented by Ken Foust, Intel Corporation. Ken is the sensor technologist and researcher who leads sensing initiatives across Intel’s product portfolio and R&D labs.

Presented by Mikko Muukki, Huawei. Mikko is the technical lead for MIPI CCS and an expert in imaging and video technology at Huawei.  

Presented by Robert Gough, Intel Corporation, Chair of Software Working Group

Presented by Dale Stolitzka, Samsung Display Co. & Chair of the MIPI Display Working Group.

Presented by Jason Peck, Texas Instruments & vice chair of the MIPI Debug Working Group.

Presented by Lalan Mishra, Qualcomm Technologies, Inc. and Satwant Singh, Lattice Semiconductor, both vice chairs of the MIPI RIO Working Group.

Presented by Haran Thanigasalam, Intel Corporation & Chair of the MIPI Camera Working Group.

Presented by Jürgen Urban, Toshiba & Chair of the MIPI UniPro Working Group.

Presented by Jim Ross, Skyworks Solutions (Chair MIPI RFFE WG) and John Oakley, Intel Corporation (Vice-chair MIPI RFFE WG)

Presented by Pierre Bossart, Principal Engineer in the Intel Open-Source Technology Center and Chair of MIPI LML Working Group.